TECHTO Electronics Secures Significant IFU Funding to Expand Production Capacity
Photo courtesy of IFU: Jesper Holst, CEO of EKTOS (seated left), and Lisbeth Erlands, Senior Vice President, Head of Healthcare and Eastern Europe at IFU (seated right). Standing from left: the Danish Ambassador to Ukraine, Ole Egberg Mikkelsen, and the Danish Minister for Development Cooperation and Global Climate Policy, Dan Jørgensen
TECHTO Electronics has secured a loan of over half a million Euros from the Investment Fund for Developing Countries – IFU. IFU invests in financially viable companies, aiming to foster the green transition, spur economic and social development, and advance the realization of the UN Sustainable Development Goals in investment countries. The funds secured by TECHTO, available in Q2 2024, mark a significant milestone for the company’s growth strategy.
The loan will primarily be allocated towards the acquisition of equipment aimed at doubling the PCB assembly capacity of TECHTO Electronics. This investment includes the installation of a fully-fledged automatic Surface Mount Technology (SMT) line, featuring a solder paste printer, three SMT machines, a reflow oven, and a modern 3D Automated Optical Inspection (AOI) system.
In addition to these enhancements, the production site in Ukraine is slated to undergo organizational measures that will further quadruple its capacity, beginning in Q3 2024.
This includes the introduction of a 2nd work shift, optimized workflow processes, streamlined logistics, and enhanced personnel training programs to ensure seamless operations and maximize output.
To complement the expanded production line, TECHTO Electronics will also introduce automatic sealing, cleaning, and protective coating equipment, ensuring the highest quality standards and additional processes that add value to its products. These additional measures will bolster product durability and reliability for meeting the stringent requirements of both existing and future clients.
Despite this significant capacity increase, we remain flexible and capable of accommodating both prototype orders ranging from 1-5 pieces and mass production quantities numbering in the thousands of Printed Circuit Board Assemblies (PCBAs) per month. This versatility positions us as a preferred partner for clients seeking tailored solutions to their electronic manufacturing needs said Oleg Senyk, CEO – TECHTO factory in Ukraine.
This substantial IFU funding not only positions TECHTO Electronics for rapid expansion but also underscores its dedication to delivering top-tier electronic solutions to its clients worldwide. Stay tuned for further updates as we embark on this exciting journey of growth and innovation.
TECHTO Electronics sikrer betydelig IFU-finansiering til udvidelse af produktionskapacitet
TECHTO Electronics har sikret et lån på over en halv million euro fra Investeringsfonden for Udviklingslande – IFU. IFU investerer i finansielt levedygtige virksomheder med målet om at fremme den grønne omstilling, stimulere økonomisk og social udvikling og fremskynde realiseringen af FN’s verdensmål for bæredygtig udvikling i investeringslandene. De midler, som TECHTO har sikret, er tilgængelige i andet kvartal af 2024 og markerer en betydelig milepæl for virksomhedens vækststrategi.
Lånet vil primært blive allokeret til anskaffelse af udstyr, der sigter mod at fordoble kapaciteten for samling af printkort hos TECHTO Electronics. Denne investering inkluderer installationen af en fuldt udviklet automatisk Surface Mount Technology (SMT) linje, som omfatter en loddepasta printer, tre SMT maskiner, en reflow-ovn og et moderne 3D automatisk optisk inspektionssystem (AOI).
Ud over disse forbedringer vil produktionsstedet i Ukraine gennemgå organisatoriske tiltag, der yderligere vil firedoble dets kapacitet, startende i tredje kvartal 2024. Dette omfatter introduktion af to arbejdsskift, optimerede arbejdsprocesser, strømlinede logistikker og forbedrede personaletræningsprogrammer for at sikre gnidningsløse operationer og maksimere output.
For at supplere den udvidede produktionslinje vil TECHTO Electronics også introducere automatisk forsegling, rengøring og beskyttende belægningsudstyr, der sikrer de højeste kvalitetsstandarder og yderligere processer, der tilføjer værdi til deres produkter. Disse yderligere foranstaltninger vil styrke produktets holdbarhed og pålidelighed for at opfylde de strenge krav fra både eksisterende og fremtidige kunder.
På trods af denne betydelige kapacitetsforøgelse forbliver vi fleksible og i stand til at imødekomme både prototypeordrer, der spænder fra 1-5 stykker, og masseproduktionsmængder i tusindvis af samlede printkort (PCBA’er) om måneden. Denne alsidighed positionerer os som en foretrukken partner for kunder, der søger skræddersyede løsninger til deres elektroniske produktionsbehov, sagde Oleg Senyk, administrerende direktør for TECHTO-fabrikken i Ukraine.
Denne betydelige IFU-finansiering positionerer ikke kun TECHTO Electronics til hurtig ekspansion, men understreger også vores dedikation til at levere førsteklasses elektroniske løsninger til kunder globalt. Der kommer yderligere opdateringer, når vi begiver os ud på denne spændende rejse med vækst og innovation.
